Bioplastics

Conductor structures for biodegradable electronics

By Michael Hoffmann, Senior Scientist, Fraunhofer Institute for Organic Electronics,
Electron Beam and Plasma Technology FEP

Introduction. Electronic components that are completely broken down in a biological environment after a pre-defined operating life open up novel applications as well as ways for reducing their ecological footprint.
A novel application area for these innovative electronic components for example, is in the field of active medical implants that after expiration of their operating life are resorbed by tissue, thereby sparing the patient a second surgical intervention.
The Fraunhofer Gesellschaft e. V. is now funding the «bioElektron – Biodegradable Electronics for Active Implants» project through its in-house program (funding No. MAVO B31 301). The project partners are Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP (coordinator), Fraunhofer Institute for Electronic Nano Systems ENAS, Fraunhofer Institute for Biomedical Engineering IBMT, Fraunhofer Institute for Silicate Research ISC and Fraunhofer Project Group Materials Recycling and Resource Strategies IWKS. The goal of the project is the development of essential components for biodegradable electronic parts that can be employed, for example, in an implant.

Fraunhofer Institute for Organic Electronics, Electron Beam and
Plasma Technology FEP, D-01109 Dresden, www.fep.fraunhofer.de