A breakthrough in high metal adhesion

There is increasing demand in the industry for higher levels of metal adhesion on metallized film due to the need for more complex packaging structures which requires a lamination peel strength suitable for functional needs. Discussing the issue with Nick Copeland, R&D Director from Bobst Manchester.

A common problem is poor metal adhesion. What can be done about this? Traditional metallization, even with in-vacuum plasma treatment, can result in inadequate metal to polymer substrate bonding, this could result in de-lamination which leads to packaging failure and results in product rejects and loss of reputation. To address this issue, it is necessary to create direct chemical bonds between the aluminium coating and the polymer surface to improve the metal to substrate bonding.

Bobst Manchester Ltd., OL10 2TL Heywood UK,
At Print4All: Bobst Firenze Srl: Hall 18, Booths D24, E23